Arbeitsspeicher
- SO-DIMM DDR4 3200 MHz
- 16 GB (1 RAM-Modul)
- Anschluss: 260-pin, Spannung: 1.2 Volt, Latenzzeiten: CL22 (22-22-22)
- Ranks/Bänke: Single Rank x8, non ECC
- DIMM DDR4 3200 MHz
- 8 GB (1 RAM-Modul)
- Anschluss: 288-pin, Spannung: 1.2 Volt
- Ranks/Bänke - 1 Rank x 16
- Typ DDR4 SO-DIMM 260-Pin, Module 2x 32GB, JEDEC PC4-25600S
- CAS Latency CL - 20
- Row-to-Column Delay tRCD - 22
- Row Precharge Time tRP - 22
- Spannung 1.2V, Modulhöhe 30mm, Intel XMP 2.0
- Typ DDR4 DIMM 288-Pin, Module 1x 8GB, JEDEC PC4-28800U
- CAS Latency CL - 16
- Row-to-Column Delay tRCD - 18
- Row Precharge Time tRP - 18
- Spannung 1.35V, Modulhöhe 34mm, Intel XMP 2.0
- Typ DDR4 DIMM 288-Pin, Module 2x 16GB, JEDEC PC4-28800U
- CAS Latency CL - 18
- Row-to-Column Delay tRCD - 22
- Row Precharge Time tRP - 22
- Spannung 1.35V, Modulhöhe 34mm, Intel XMP 2.0
- Typ DDR5 DIMM 288-Pin, Module 2x 32GB, JEDEC PC5-44800U
- CAS Latency CL - 40
- Row-to-Column Delay tRCD - 40
- Row Precharge Time tRP - 40
- Spannung 1.25V, Modulhöhe 34.9mm, Intel XMP 3.0
- Typ DDR5 DIMM 288-Pin, Module 2x 8GB, JEDEC PC5-41600U
- CAS Latency CL - 40
- Row-to-Column Delay tRCD - 40
- Row Precharge Time tRP - 40
- Spannung 1.25V, Modulhöhe 34.9mm, Intel XMP 3.0
- Typ DDR4 DIMM 288-Pin, Module 2x 8GB, JEDEC PC4-28800U
- CAS Latency CL - 17
- Row-to-Column Delay tRCD - 21
- Row Precharge Time tRP - 21
- Spannung 1.35V, Modulhöhe 34mm, Intel XMP 2.0
- Typ DDR4 SO-DIMM 260-Pin, Module 2x 8GB, JEDEC PC4-25600S
- CAS Latency CL - 20
- Row-to-Column Delay tRCD - 22
- Row Precharge Time tRP - 22
- Spannung 1.2V, Modulhöhe 30mm, Intel XMP 2.0